Substrate processing apparatus

ABSTRACT

A substrate processing apparatus including a transport chamber having an end and defining more than one substantially linear substrate transport zone where each transport zone extends longitudinally along the transport chamber between opposing walls of the transport chamber and at least one of the more than one substantially linear substrate transport zones is configured as a supply zone for enabling transport of substrates from the end and at least one of the more than one substantially linear substrate transport zones is configured as a return zone for enabling transport of substrates to the end, and at least one substrate transport located in and movably mounted to the transport chamber for transporting substrates along the more than one substantially linear substrate transport zone, where each substrate transport zone is configured to allow the at least one substrate transport to move from one transport zone to another transport zone.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This is a continuation of application Ser. No. 13/195,401, filed Aug. 1,2011 (now U.S. Pat. No. 8,371,792) which is a continuation ofapplication Ser. No. 10/962,787, filed Oct. 9, 2004 (now U.S. Pat. No.7,988,398) which is a continuation-in-part of application Ser. No.10/624,987, filed Jul. 22, 2003, which claims the benefit of U.S.Provisional Application No. 60/397,895, filed Jul. 22, 2002, which areincorporated by reference herein in their entirety.

BACKGROUND INFORMATION

1. Field

The embodiments and methods described herein relate to substrateprocessing apparatus and, more particularly, to substrate processingapparatus with chambers interconnected in a Cartesian arrangement.

2. Brief Description of Earlier Developments

One of the factors affecting consumer desire for new electronic devicesnaturally is the price of the device. Conversely, if the cost, and hencethe price of new electronic devices can be lowered, it would appear thata beneficial effect would be achieved in consumer desires for newelectronic devices. A significant portion of the manufacturing costs forelectronic devices is the cost of producing the electronics which startswith the manufacturing and processing of semi-conductor substrates suchas used in manufacturing electronic components, or panels used formaking displays. The cost of processing substrates is affected in partby the cost of the processing apparatus, the cost of the facilities inwhich the processing apparatus are housed, and in large part by thethroughput of the processing apparatus (which has significant impact onunit price). As can be immediately realized, the size of the processingapparatus itself impacts all of the aforementioned factors. However, itappears that conventional processing apparatus have reached a dead endwith respect to size reduction. Moreover, conventional processingapparatus appear to have reached a limit with respect to increasingthroughput per unit. For example, conventional processing apparatus mayuse a radial processing module arrangement. A schematic plan view of aconventional substrate processing apparatus is shown in FIG. 1. As canbeen seen, the processing modules of the apparatus in FIG. 1 are placedradially around the transport chamber of the processing apparatus. Thetransport apparatus, which is a conventional two or three axis ofmovement apparatus (e.g. Z, θ, T Axis) is centrally located in thetransport chamber to transport substrates between processing modules. Ascan be realized from FIG. 1, throughput of the conventional processingapparatus is limited by the handling rate of the transport apparatus. Inother words, throughput cannot be increased with the conventionalapparatus by merely adding processing modules to the apparatus, becauseonce the transport apparatus reaches a handling rate peak, this becomesthe controlling factor for throughput. The apparatus of the presentinvention overcome the problems of the prior art as will be describedfurther below.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and other features of the present invention areexplained in the following description, taken in connection with theaccompanying drawings, wherein:

FIG. 1 is a schematic plan view of a substrate processing apparatus inaccordance with the prior art;

FIG. 2 is a schematic plan view of a substrate processing apparatusincorporating features of the present invention in accordance with afirst embodiment;

FIG. 3 is a schematic plan view of a substrate processing apparatus inaccordance with another embodiment of the present invention;

FIGS. 4-5 are respectively schematic plan views of substrate processingapparatus in accordance with still other embodiments of the presentinvention;

FIG. 6 is a schematic plan view of a substrate processing apparatus inaccordance with yet another embodiment of the present invention;

FIG. 7 is a schematic plan view of a substrate processing system withtwo substrate processing apparatus in accordance with anotherembodiment, and FIG. 7A is another schematic plan view of the substrateprocessing system in accordance with yet another embodiment;

FIG. 8 is a schematic plan view of another conventional substrateprocessing apparatus;

FIG. 9 is a schematic plan view of a conventional substrate processingsystem including a number of conventional processing apparatus and astocker;

FIG. 10 is an end view of a platen drive system of the substrateprocessing apparatus;

FIGS. 11A-11B are respectively an end view, and a section view (takenalong lines 11B-11B in FIG. 11A) of another platen drive system of thesubstrate processing apparatus;

FIG. 12 is a top view of an exemplary cart of the substrate processingapparatus in accordance with another embodiment of the apparatus;

FIG. 12A is another top view of the exemplary cart in FIG. 12 with thecart shown in an extended position;

FIG. 12B is an end view of the exemplary cart in FIG. 12 in a portion ofa chamber of the apparatus;

FIG. 13A is a top end view of a portion of a chamber of the apparatuswith a drive system and transport cart in accordance with anotherembodiment of the apparatus;

FIG. 13B-13C respectively are a section view of the chamber and carttaken along lines 13B-13B in FIG. 13A, and another section view takenalong lines 13C-13C in FIG. 13B;

FIG. 13D is a schematic diagram of an exemplary drive system of theapparatus;

FIG. 14A is an end view of another embodiment of a cart used with theapparatus in FIG. 2;

FIG. 14B is a graph illustrating the relationship between axialdeflection Z and a restoring force F of the drive system;

FIGS. 15-16 are respectively a schematic perspective view and anexploded elevation view of semiconductor workpiece transport cart of theapparatus in accordance with another embodiment;

FIG. 17 is a schematic perspective view of the transport cart inaccordance with another embodiment;

FIG. 18 is a cross-section of a portion of the transport apparatus inFIG. 2 and a workpiece chuck rotation device of the apparatus;

FIGS. 19-20 respectively are elevation views of the workpiece chuckrotation device and a transport cart of the apparatus with the transportcart in different positions;

FIG. 21 is another schematic elevation of the chuck rotation device inaccordance with yet another embodiment; and

FIGS. 22-23 respectively are a schematic top plan view and schematicelevation view of yet another embodiment of the transport cart for theapparatus;

FIGS. 23A-23B respectively are other top plan views of the transportcart in FIG. 22 with a transfer arm of the cart in two differentpositions;

FIG. 24 is a schematic elevation view of another embodiment of thetransport cart;

FIGS. 24A-24C respectively are plan views of the transport cart in FIG.24 with the transport arm linkage of the cart in three differentpositions;

FIG. 25 is a schematic elevation view of still another embodiment of thetransport cart;

FIGS. 25A-25C respectively are plan views of the transport cart in FIG.25 with the transport arm linkage of the cart in three differentpositions;

FIG. 26 is a schematic diagram of system control software in thecontroller of the apparatus.

FIG. 27 is a schematic plan view of a substrate processing system inaccordance with yet another exemplary embodiment of the invention;

FIG. 28 is a cross-sectional elevation view of a representative moduleof a transport chamber of the system in FIG. 27;

FIG. 29 is a cross-sectional view of the chamber module taken along line29-29 in FIG. 28; and

FIG. 30 is a bottom view of a substrate transport of the system in FIG.27.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Referring to FIG. 2, there is shown a schematic plan view of a substrateprocessing apparatus 10 incorporating features of the present invention.Although the present invention will be described with reference to theembodiments shown in the drawings, it should be understood that thepresent invention can be embodied in many alternate forms ofembodiments. In addition any suitable size, shape or type of elements ormaterials could be used.

The substrate processing apparatus 10 is connected to an environmentalfront end module (EFEM) 14 which has a number of load ports 12 as shownin FIG. 2. The load ports 12 are capable of supporting a number ofsubstrate storage canisters such as for example conventional FOUPcanisters; though any other suitable type may be provided. The EFEM 14communicates with the processing apparatus through load locks 16 whichare connected to the processing apparatus as will be described furtherbelow. The EFEM 14 (which may be open to atmosphere) has a substratetransport apparatus (not shown) capable of transporting substrates fromload ports 12 to load locks 16. The EFEM 14 may further includesubstrate alignment capability, batch handling capability, substrate andcarrier identification capability or otherwise. In alternateembodiments, the load locks 16 may interface directly with the loadports 12 as in the case where the load locks have batch handlingcapability or in the case where the load locks have the ability totransfer wafers directly from the FOUP to the lock. Some examples ofsuch apparatus are disclosed in U.S. Pat. Nos. 6,071,059, 6,375,403,6,461,094, 5,588,789, 5,613,821, 5,607,276, 5,644,925, 5,954,472,6,120,229 and U.S. patent application Ser. No. 10/200,818 filed Jul. 22,2002 all of which are incorporated by reference herein in theirentirety. In alternate embodiments, other lock options may be provided.

Still referring to FIG. 2, the processing apparatus 10, which as notedbefore may be used for processing semiconductor substrates (e.g. 200/300mm wafers), panels for flat panel displays, or any other desired kind ofsubstrate, generally comprises transport chamber 18, processing modules20, and at least one substrate transport apparatus 22. The substratetransport apparatus 22 in the embodiment shown is integrated with thechamber 18. In this embodiment, processing modules are mounted on bothsides of the chamber. In other embodiments, processing modules may bemounted on one side of the chamber as shown for example in FIG. 4. Inthe embodiment shown in FIG. 2, processing modules 20 are mountedopposite each other in rows Y1, Y2 or vertical planes. In otheralternate embodiments, the processing modules may be staggered from eachother on the opposite sides of the transport chamber or stacked in avertical direction relative to each other. The transport apparatus 22has a cart 22C that is moved in the chamber to transport substratesbetween load locks 16 and the processing chambers 20. In the embodimentshown, only one cart 22C is provided, in alternate embodiments, morecarts may be provided. As seen in FIG. 2, the transport chamber 18(which is subjected to vacuum or an inert atmosphere or simply a cleanenvironment or a combination thereof in its interior) has aconfiguration, and employs a novel substrate transport apparatus thatallows the processing modules to be mounted to the chamber 18 in a novelCartesian arrangement with modules arrayed in substantially parallelvertical planes or rows. This results in the processing apparatus 10having a more compact footprint than a comparable conventionalprocessing apparatus (i.e. a conventional processing apparatus with thesame number of processing modules) as is apparent from comparing FIGS. 1and 2. Moreover, the transport chamber 22 may be capable of beingprovided with any desired length to add any desired number of processingmodules, as will be described in greater detail below, in order toincrease throughput. The transport chamber may also be capable ofsupporting any desired number of transport apparatus therein andallowing the transport processing chamber on apparatus to reach anydesired processing chamber on the transport chamber without interferingwith each other. This in effect decouples the throughput of theprocessing apparatus from the handling capacity of the transportapparatus, and hence the processing apparatus throughput becomesprocessing limited rather than handling limited. Accordingly, throughputcan be increased as desired by adding processing modules andcorresponding handling capacity on the same platform.

Still referring to FIG. 2, the transport chamber 18 in this embodimenthas a general rectangular shape though in alternate embodiments theallow chamber may have any other suitable shape. The chamber 18 has aslender shape (i.e. length much longer than width) and defines agenerally linear transport path for the transport apparatus therein. Thechamber 18 has longitudinal side walls 18S. The side walls 18S havetransport openings or ports 18O formed therethrough. The transport ports18O are sized large enough to substrates to pass through the ports (canbe through valves) into and out of the transport chamber. As can be seenin FIG. 2, the processing modules 20 in this embodiment are mountedoutside the side walls 18S with each processing module being alignedwith a corresponding transport port in the transport chamber. As can berealized, each processing module 20 may be sealed against the sides 18Sof the chamber 18 around the periphery of the corresponding transportaperture to maintain the vacuum in the transport chamber. Eachprocessing module may have a valve, controlled by any suitable means toclose, the transport port when desired. The transport ports 18O may belocated in the same horizontal plane. Accordingly, the processingmodules on the chamber are also aligned in the same horizontal plane. Inalternate embodiments the transport ports may be disposed in differenthorizontal planes. As seen in FIG. 2, in this embodiment, the load locks16 are mounted to the chamber sides 18S at the two front most transportports 18O. This allows the load locks to be adjacent the EFEM 14 at thefront of the processing apparatus. In alternate embodiments, the loadlocks may be located at any other transport ports on the transportchamber such as shown for example in FIG. 4. The hexahedron shape of thetransport chamber allows the length of the chamber to be selected asdesired in order to mount as many rows of processing modules as desired(for example see FIGS. 3, 5, 6-7A showing other embodiments in which thetransport chamber length is such to accommodate any number of processingmodules).

As noted before, the transport chamber 18 in the embodiment shown inFIG. 2 has one substrate transport apparatus 22 having a single cart22C. The transport apparatus 22 is integrated with the chamber totranslate cart 22C back and forth in the chamber between front 18F andback 18B. The transport apparatus 22 has cart 22C having end effectorsfor holding one or more substrates. The cart 22C of transport apparatus22 also has an articulated arm or movable transfer mechanism 22A forextending and retracting the end effectors in order to pick or releasesubstrates in the processing modules or load locks. To pick or releasesubstrates from the processing modules/load ports, the transportapparatus 22 may be aligned with desired module/port and the arm isextended/retracted through the corresponding port 18O to position theend effector inside the module/port for the substrate pick/release.

The transport apparatus 22, shown in FIG. 2 is a representativetransport apparatus and, includes a cart 22C which is supported fromlinear support/drive rails. The transport apparatus will be described ingreater detail below. The linear support/drive rails may be mounted tothe side walls 18S, floor, or top of the transport chamber and mayextend the length of the chamber. This allows the cart 22C, and hence,the apparatus to traverse the length of the chamber. The cart has aframe, which supports the arm. The frame also supports caster mounts orplatens 22B, which move with or relative to the frame. As will also bedescribed further below, a sequential synchronous linear motor 30 drivesthe platens 22B and hence the cart 22C along the rails. The linear motor30 may be located in the floor or side walls 18S of the transportchamber. A barrier, as will be seen further below, may be locatedbetween the windings of the motor and the motive portion of the platensto isolate the windings from the interior of the chamber. In general,the linear motor may include a number of drive zones. The drive zonesare located at locations along the transport chamber where the arm 22Ais extended/retracted (i.e. at the rows Y0-Y2 in this embodiment ofmodules/ports). The number and density of drive zones is dependent onthe number of platens per cart, the number of motors per chamber, thenumber of process modules or exchange points etc. In this embodiment,the arm is operably connected to the platens 22A by a suitablelinkage/transmission so that when the platens are moved by a drive motorin relative motion to each other the arm is extended or retracted. Forinstance, the transmission may be arranged so that when the platens aremoved apart along the rails the arm is extended to the left, and whenmoved back closer together the arm is retracted from the left. Theplatens may also be suitably operated by a linear motor toextend/retract the arm 22A to/from the right. The control of movement ofthe platens over the slide rails with the linear motor, as well asposition sensing of the platens and hence of the cart and theextended/retracted position of the arm may be accomplished in accordancewith international application having publication numbers WO 99/23504;99/33691; 01/02211; 01/38124; and 01/71684, which are incorporated byreference herein in their entireties. As can be realized, the platensmay be driven in unison in one direction in order to move the entirecart/apparatus in that longitudinal direction inside the transportchamber.

FIG. 3 shows another embodiment of a substrate processing apparatus 10′which is generally similar to apparatus 10. In this embodiment, thetransport chamber 18′ has two transport apparatus 22A, 22B. Thetransport apparatus 122A, 122B are substantially the same as theapparatus 22 in the previously described embodiment. Both transportapparatus 122A, 122B may be supported from a common set of longitudinalslide rails as described before. The platens of the cart correspondingto each apparatus may be driven by the same linear motor drive. Thedifferent drive zones of the linear motor allow the independent drivingof individual platens on each cart and thus also the independent drivingof each individual cart 122A, 122B. Thus, as can be realized the arm ofeach apparatus can be independently extended/retracted using the linearmotor in a manner similar to that described before. However, in thiscase the substrate transport apparatus 122A, 122B are not capable ofpassing each other in the transport chamber unless separate slidesystems are employed. Accordingly, the processing modules are positionedalong the length of the transport chamber so that the substrate may betransported to be processed in the processing module in a sequence whichwould avoid the transport apparatus from interfering with each other.For example, processing modules for coating may be located beforeheating modules, and cooling modules and etching modules may be locatedlast.

However, the transport chamber 18′ may have another transport zone 18′A,18′B which allow the two transport apparatus to pass over each other(akin to a side rail, bypass rail or magnetically suspended zone thatdoes not require rails). In this case, the other transport zone may belocated either above or below the horizontal plane (s) in which the,processing modules are located. In this embodiment the transportapparatus has two slide rails, one for each transport apparatus. Oneslide rail may be located in the floor, or side walls of the transportchamber, and the other slide rail may be located in the top of thechamber. In alternate embodiments, a linear drive system may be employedwhich simultaneously drives and suspends the carts where the carts maybe horizontally and vertically independently moveable, hence allowingthem independent of each other to pass or transfer substrates. In allembodiments employing electric windings, these windings may also be usedas resistance heaters as in the case where it is desired that thechamber be heated for degas as in the case to eliminate water vapor forexample. Each transport apparatus in this case may be driven by adedicated linear drive motor or a dedicated drive zone in which the cartresides similar to that described before.

Referring now to FIGS. 6, and 7 there are shown other substrateprocessing apparatus in accordance with other embodiments of the presentinvention. As seen in FIGS. 6 and 7 the transport chamber in theseembodiments is elongated to accommodate additional processing modules.The apparatus shown in FIG. 6 has twelve (12) processing modulesconnected to the transport chamber, and each apparatus (two apparatusare shown) in FIG. 7 has 24 processing module connected to the transportchamber. The numbers of processing modules shown in these embodimentsare merely exemplary, and the apparatus may have any other number ofprocessing modules as previously described. The processing modules inthese embodiments are disposed along the sides of the transport chamberin a Cartesian arrangement similar to that previously discussed. Thenumber of rows of processing modules in these case however have beengreatly increased (e.g. six (6) rows in the apparatus of FIG. 6, andtwelve (12) rows in each of the apparatus of FIG. 7). In the embodimentof FIG. 6, the EFEM may be removed and the load ports may be mateddirectly to load locks. The transport chamber of the apparatus in FIGS.6, and 7 have multiple transport apparatus (i.e. three apparatus in thecase of FIG. 6, and six apparatus in the case of FIG. 7) to handle thesubstrates between the load locks and the processing chambers. Thenumber of transport apparatus shown are merely exemplary and more orfewer apparatus may be used. The transport apparatus in theseembodiments are generally similar to that previously described,comprising an arm and a cart. In this case, however, the cart issupported from zoned linear motor drives in the side walls of thetransport chamber. The linear motor drives in this case provide fortranslation of the cart in two orthogonal axis (i.e. longitudinally inthe transport chamber and vertically in the transport chamber).Accordingly, the transport apparatus are capable of moving past oneanother in the transport chamber. The transport chamber may have“passing” or transport areas above and/or below the plane (s) of theprocessing modules, through which the transport apparatus may be routedto avoid stationary transport apparatus (i.e. picking/releasingsubstrates in the processing modules) or transport apparatus moving inopposite directions. As can be realized, the substrate transportapparatus has a controller for controlling the movements of the multiplesubstrate transport apparatus.

Still referring to FIG. 7, the substrate processing apparatus 18A and18B in this case may be mated directly to a tool 300. As may be realizedfrom FIGS. 3, 5 and 6-7 the transport chamber 18 may be extended asdesired to run throughout the processing facility P. As seen in FIG. 7,and as will be described in further detail below, the transport chambermay connect and communicate with various sections or bays, 18A, 18B inthe processing facility P such as for example storage, lithography tool,metal deposition tool or any other suitable tool bays. Baysinterconnected by the transport chamber 18 may also be configured asprocess bays or processes 18A, 18B. Each bay has desired tools (e.g.lithography, metal deposition, heat soaking, cleaning) to accomplish agiven fabrication process in the semiconductor workpiece. In eithercase, the transport chamber 18 has processing modules, corresponding tothe various tools in the facility bays, communicably connected thereto,as previously described, to allow transfer of the semiconductorworkpiece between chamber and processing modules. Hence, the transportchamber may contain different environmental conditions such asatmospheric, vacuum, ultra high vacuum, inert gas, or any other,throughout its length corresponding to the environments of the variousprocessing modules connected to the transport chamber. Accordingly, thesection 18P1 of the chamber in a given process or bay 18A, 18B, orwithin a portion of the bay, may have for example, one environmentalcondition (e.g. atmospheric), and another section 18P2, 18P3 of thechamber may have a different environmental condition. As noted before,the section 18P1, 18P2, 18P3 of the chamber with different environmentstherein may be in different bays of the facility, or may all be in onebay of the facility. FIG. 7 shows the chamber 18 having three sections18P1, 18P2, 18P3 with different environments for example purposes only.The chamber 18 in this embodiment may have as many sections with as manydifferent environments as desired.

As seen in FIG. 7, the transport apparatus, similar to apparatus 122A,(see also FIG. 3) in the chamber 18 are capable of transiting betweensections 18P1, 18P2, 18P3 of the chamber with different environmentstherein. Hence, as can be realized from FIG. 7, the transport apparatus122A may with one pick move a semiconductor workpiece from the tool inone process or bay 18A of the processing facility to another tool with adifferent environment in a different process or bay 18B of the processfacility. For example, transport apparatus 122A may pick a substrate inprocessing module 301, which may be an atmospheric module, lithography,etching or any other desired processing module in section 18P1, oftransport chamber 18. The transport apparatus 122A may then move in thedirection indicated by arrow X3 in FIG. 7 from section 18P1 of thechamber to section 18P3. In section 18P3, the transport apparatus 122Amay place the substrate in processing module 302, which may be anydesired processing module.

As can be realized from FIG. 7, the transport chamber may be modular,with chamber modules connected as desired to form the chamber 18. Themodules may include internal walls 181, similar to walls 18F, 18R inFIG. 2, to segregate sections 18P1, 18P2, 18P3, 18P4 of the chamber.Internal walls 181 may include slot valves, or any other suitable valveallowing one section of the chamber 18P1, 18P4 to communicate withadjoining section. The slot valves 18V, may be sized to allow, one ormore carts to transit through the valves from one section 18P1, 18P4 toanother. In this way, the carts 122A may move anywhere throughout thechamber 18. The valves may be closed to isolate sections 18P1, 18P2,18P3, 18P4 of the chamber so that the different sections may containdisparate environments as described before. Further, the internal wallsof the chamber modules may be located to form load locks 18P4 as shownin FIG. 2. The load locks 18P4 (only one is shown in FIG. 2 for examplepurposes) may be located in chamber 18 as desired and may hold anydesired number of carts 122A therein.

In the embodiment shown in FIG. 7, processes 18A and 18B may be the sameprocess, for example etch, where the processing apparatus 18A and 18B incombination with tool 300 being a stocker are capable of processingequal amounts of substrates as, for example the apparatus shown in FIG.9 but without the associated material handling overhead associated withtransporting FOUPS from the stocker to individual process tools via anAMHS, and transporting individual wafers via EFEM's to the respectiveprocessing tools. Instead, the robot within the stocker directlytransfers FOUPS to the load ports (3 shown per tool more or less couldbe provided depending on throughput requirements) where the wafers arebatch moved into locks and dispatched to their respective processmodule(s) depending on the desired process and/or throughput required.In this manner, in a steady state fashion, the FIG. 7 apparatus and FIG.9 apparatus may have the same throughput, but the apparatus in FIG. 7does it with less cost, lower footprint, less WIP required—therefor lessinventory and with a quicker turnaround when looking at the time toprocess a single carrier lot (or “hot lot”) resulting in significantadvantages for the fab operator. Within the tool 18A, 18B or the stocker300 may further have metrology capability, sorting capability, materialidentification capability, test capability, inspection capability (putboxes . . . ) etc. as required to effectively process and testsubstrates.

In the embodiment shown in FIG. 7, more or less processes 18A and 18Bmay be provided that are different processes, for example etch, CMP,copper deposition, PVD, CVD, etc. . . . where the processing apparatus18A, 18B, etc. in combination with tool 300 being, for example aphotolithography cell are capable of processing equal amounts ofsubstrates as, for example multiple apparatus shown in FIG. 9 butwithout the associated material handling overhead associated withtransporting FOUPs from stockers to individual process tool bays and alithography bay via an AMHS, and transporting individual wafers viaEFEM's to the respective processing tools. Instead, the automationwithin the lithography cell directly transfers FOUPS, substrates ormaterial to the load ports (3 shown per process type, more or less couldbe provided depending on throughput requirements) where the substratesare dispatched to their respective process depending on the desiredprocess and/or throughput required. An example of such an alternative isshown in FIG. 7A. In this manner, the apparatus in FIG. 7 processessubstrates with less cost, lower footprint, less WIP required—thereforless inventory and with a quicker turnaround when looking at the time toprocess a single carrier lot (or “hot lot”), and with a higher degree ofcontamination control resulting in significant advantages for the faboperator. Within the tool 18A, 18B or the tool or cell 300 may furtherhave metrology capability, processing capability, sorting capability,material identification capability, test capability, inspectioncapability (put boxes . . . ) etc. . . . as required to effectivelyprocess and test substrates. As can be realized from FIG. 7, theprocessing apparatus 18A, 18B, and tool 300 may be coupled to share acommon controller environment (e.g. inert atmosphere, or vacuum). Thisensures that substrates remain in a controlled environment from tool 300and throughout the process in apparatus 18A, 18B. This eliminates use ofspecial environment controls of the FOUPs as in conventional apparatusconfiguration shown in FIG. 8.

Referring now to FIG. 7A, there is shown an exemplary fabricationfacility layout 601 incorporating features of the embodiment shown inFIG. 7. Carts 406, similar to carts 22A, 122A transport substrates orwafers through process steps within the fabrication facility 601 throughtransport chambers 602, 604, 606, 608, 610, 612, 614, 616, 618, 620,624, 626. Process steps may include epitaxial silicon 630, dielectricdeposition 632, photolithography 634, etching 636, ion implantation 638,rapid thermal processing 640, metrology 642, dielectric deposition 644,etching 646, metal deposition 648, electroplating 650, chemicalmechanical polishing 652. In alternate embodiments, more or lessprocesses may be involved or mixed; such as etch, metal deposition,heating and cooling operations in the same sequence. As noted before,carts 406 may be capable of carrying a single wafer or multiple wafersand may have transfer capability, such as in the case where cart 406 hasthe capability to pick a processed wafer and place an unprocessed waferat the same module. Carts 406 may travel through isolation valves 654for direct tool to tool or bay to bay transfer or process to processtransfer. Valves 654 may be sealed valves or simply conductance typevalves depending upon the pressure differential or gas speciesdifference on either side of a given valve 654. In this manner, wafersor substrates may be transferred from one process step to the next witha single handling step or “one touch”. As a result, contamination due tohandling is minimized. Examples of such pressure or species differencecould be for example, clean air on one side and nitrogen on the other;or roughing pressure vacuum levels on one side and high vacuum on theother; or vacuum on one side and nitrogen on the other. Load locks 656,similar to chambers 184P4 in FIG. 7, may be used to transition betweenone environment and another; for example between vacuum and nitrogen orargon. In alternate embodiments, other pressures or species may beprovided in any number of combinations. Load locks 656 may be capable oftransitioning a single carrier or multiple carriers. Alternately,substrate (s) may be transferred into load lock 656 on shelves (notshown) or otherwise where the cart is not desired to pass through thevalve. Additional features 658 such as alignment modules, metrologymodules, cleaning modules, process modules (ex: etch, deposition, polishetc. . . . ), thermal conditioning, modules or otherwise, may beincorporated in lock 656 or the transport chambers. Service ports 660may be provided to remove carts or wafers from the tool. Wafer orcarrier stockers 662, 664 may be provided to store and buffer processand or test wafers. In alternate embodiments, stockers 662, 664 may notbe provided, such as where carts are directed to lithography toolsdirectly. Another example is where indexer or wafer storage module 666is provided on the tool set. Re—circulation unit 668 may be provided tocirculate and or filter air or the gas species in any given section suchas tool section 612. Re—circulation unit 668 may have a gas purge,particle filters, chemical filters, temperature control, humiditycontrol or other features to condition the gas species being processed.In a given tool section more or less circulation and or filter orconditioning units may be provided. Isolation stages 670 may be providedto isolate carts and/or wafers from different process or tool sectionsthat can not be cross contaminated. Locks or interconnects 672 may beprovided to change cart orientation or direction in the event the cartmay pick or place within a generic workspace without an orientationchange. In alternate embodiments or methods any suitable combination ofprocess sequences or make up could be provided.

Referring now to FIG. 10, there is shown an end view of an exemplarysingle axis platen drive system 320 in accordance with one embodiment.Drive system 320 is an example of a drive suitable for driving transportapparatus or carts 22A, 122A, 406 shown in FIGS. 2, 3, and 7-7A. System320 has a stationary winding set which drives platen 324. Platen 324 maybe supported on slide blocks 326 which are slideable on rails 328. Rails328 are coupled to a base 330, or side walls, of the transport chamber.Base 330 provides a barrier 332 between winding 322 and platen 324. Ascan be realized, barrier 332 may also isolate the winding 322 from theinterior environment of the chamber. Winding 322 is coupled to base 330.Platen may have magnets 334 coupled to it for interfacing the platen 324with winding 322. A sensor 336 may be a magneto-restrictive type halleffect sensor and may be provided for sensing the presence of themagnets in platen 324 and determining proper commutation. Additionally,sensors 336 may be employed for fine position determination of platen324. Position feedback device 340 may be provided for accurate positionfeedback. Device 340 may be inductive or optical for example. In theinstance where it is inductive, an excitation source 342 may be providedwhich excites winding or pattern 346 and inductively couples back toreceiver 344 via coupling between pattern 346. The relative phase andamplitude relationship used for determining the location of platen 324.A cart identification tag 347, such as an IR tag may be provided with areader 348 provided at appropriate stations to determine cart id bystation.

Referring now to FIG. 11A, there is shown an end view of platen drivesystem 400 in accordance with another embodiment. Referring also to FIG.11B, there is shown a section view of drive system 400, taken alonglines 11B-11B in FIG. 11A. As will be described further below, system400 is capable of effecting movement of a platen or cart 406 (cart 406may be similar to carts or transport apparatus 22A, 122A describedbefore). System 400 has opposing stationary winding sets 402, 404 whichdrive cart 406. Winding sets 402, 404 are wound in a two dimensionaldriving array, vertical 408 and lateral 410. In alternate embodiments,additional arrays could be provided to drive cart 406 in differentdirections, for example 427 by coupling system 400 to another similarsystem oriented 90 degrees therefrom. The arrays are driven in multiplezones in order to allow multiple carts to be driven independently. As anexample, zone 424 could be a supply zone, zone 426 could be a transferzone, and zone 428 could be a return zone. Within each zone may besub-zones which allow driving multiple carts within each zone. Inalternate embodiments, more or less zones or sub-zones may be providedin any of a number of combinations. Cart 406 is supported by the fieldsproduced by winding sets 402, 404 and is positionable in a non-contactmanner by biasing the fields between winding sets 402 and 406. Chamber412 may be provided as a barrier 414 between winding sets 402, 404 andcart 406. Windings exist in zone 416 as shown. Cart 406 may have platens418, 420 with the windings. In alternate embodiments, more or lessplatens may be provided. Arrays of sensors may be provided for sensingthe presence of the magnets in the platens or the cart or the platensfor determining proper commutation and location and for fine positiondetermination of the platens and the cart. A cart identification tag maybe provided with a reader provided at appropriate stations to determinecart id by station.

Referring now to FIG. 12, there is shown a top view of an exemplary cart229 for the processing apparatus 10 in accordance with anotherembodiment of the apparatus. Cart 229 may be similar to carts 22, 122A,406 described before and shown in FIGS. 2, 3, and 7-7A. Cart 229 isshown as being capable of transporting substrate 148 along an axial path150 and/or a radial path 152. The cart 229 is also capable of moving thesubstrate along path 154 shown in FIG. 12. Cart 229 is shown as a twodimensional system for simplicity, however in alternate embodimentsadditional axis of motion, for example, z motion (not shown in and outof paper) or angular motion 154 could be provided. Cart 229 is shown asbeing capable of handling a single substrate 148 for simplicity.However, in alternate embodiments, additional handling could beprovided. For example, the cart may include capability to handle asecond substrate, as in the case where it is desired that a substrate beexchanged at a process module (i.e. a first, processed substrate may bepicked and a second unprocessed substrate may then be placed at the sameprocess module from the same cart 229).

Cart 229 has frame 156, end effector 158 and secondary frame 160. Slides162 constrain frame 156, end effector 158 and secondary frame 160 to beslideable relative to each other along linear path 152 either to theleft or right of frame 156 as shown. Although a linear mechanism isshown, in alternate embodiments, any suitable arm system may be usedsuch as, for example, a scara type arm coupled to frame 156 as shown inFIG. 17 and as will be described in greater detail below. Substrate 148is supported on end effector 158.

Referring now to FIG. 12A, there, is shown a top view of exemplary cart229, in a portion of chamber 229 (similar to chamber 18 and 602-626, seeFIGS. 2-3, and 7-7A). The cart has the end effector, 158 extended intoexemplary module 166. Module 166 may be similar to any of the modulesdescribed before as being connected to the transport chamber. Cart 229is shown as being capable of transporting substrate 148 along an axialpath 150 and/or a radial path 152. Cart 229 has frame 156, end effector158 and secondary frame 160. Slides 162 constrain frame 156, endeffector 158 and secondary frame 160 to be slideable relative to eachother along linear path 152 either to the left or right of frame 156 asshown. Frame 156 has magnetic platens 168 on its underside whichinterface with synchronous motor 170. Drive platen 172 interfaces withsynchronous motor 174. Drive platen 172 is mounted on the underside ofand slideable relative to frame 156 along direction 176 which issubstantially parallel to direction 150 by using bearings 178. Movementof platens 168 and 172 simultaneously along direction 150 allows cart tomove in direction 150 without motion in direction 152. Holding platens168 stationary while simultaneously moving platen 172 along direction176 relative to frame 156 causes a radial motion along direction 152 ofsubstrate and end effector 148, 158.

Linear motion of platen 172 in direction 176 is translated into linearmotion of secondary frame 160 along direction 152. Pulley 186 isrotatably coupled to frame 156 arid has secondary pulleys 188 and 182.Pulley 182 is coupled to platen 172 with bands 184 such that movement ofplaten 172 along direction 180 causes pulley 182 to rotate in direction190 with the opposite applying in opposing directions. Pulleys 192 and194 are rotatably coupled to frame 156. Cable 196 is coupled to pulley188 at point 198, wraps around pulley 192 as shown, and terminates at200 on secondary frame 160. Cable 202 is coupled to pulley 188 at point198, wraps around pulley 188 counterclockwise, wraps around pulley 194as shown and terminates at 204 on secondary frame 160. In this manner,linear motion of platen 172 in direction 176 is translated into linearmotion of secondary frame 160 along direction 152.

Linear motion of platen 172 in direction 176 and the translated linearmotion of secondary frame 160 along direction 152. also further extendsend effector 158 in direction 152 as shown. Pulleys 210 and 212 arerotatably coupled to secondary frame 160. Cable 214 is coupled to endeffector 158 at point 216, wraps around pulley 210 as shown, andterminates at 218 on frame 156. Cable 220 is coupled to end effector 158at point 222, wraps around pulley 212 and terminates at 224 on frame156. In this manner, linear motion of platen 172 in direction 176 istranslated into linear motion of secondary frame 160 along direction 152which is further translated to further extension of end effector 158 indirection 152 as shown. In lieu of cable pulleys, the transmissionsbetween platens and end effectors may use belts, bands or any othersuitable transmission means made of any suitable materials. In alternateembodiments a suitable linkage system may be used in place of cablepulleys to transmit motion from the platens to the end effectors.Retraction of the end effector 158, to the position shown substantiallyin FIG. 12, is accomplished in a similar but reverse manner. Further,extension of the end effector 158 to a position similar to but oppositefrom that shown in FIG. 12B is effected by moving platens 168, 172 in anopposite manner to that described above.

Referring now to FIG. 12B, there is shown an end view of cart 229 beforebeing extended into exemplary process module 166. Slides 240 constrainframe 156 to be slideable along linear path 150 as shown. Frame 156 hasmagnetic platens 168 on its underside which interface with synchronousmotor 170. Drive platen 172 interfaces with synchronous motor 174. Driveplaten 172 is mounted on the underside of and slideable relative toframe 156 along a direction which is substantially parallel to directionindicated by arrow 150 (see FIG. 12). Movement of platens 168 and 172simultaneously along direction 150 allows the cart to move in directionindicated by arrow 150 without motion in direction 152. Holding platens168 stationary while simultaneously moving platen 172 along direction176 relative to frame 156 causes a radial motion along direction 152 ofsubstrate and end effector 148, 158. Platens 172 and 168 may havemagnets that interface with motors 170 and 174. Chamber 244 may be madefrom a nonmagnetic material, for example nonmagnetic stainless steel andprovide a barrier 246, 248 between the motor windings and theirrespective platens. In alternate embodiments, more or less linear drivesor carts may be provided. For example, a single drive motor may beprovided-having additional drive zones where platens 168 and 172 wouldinterface with the same drive motor but be independently driveable bythe different zones. As a further example, additional carts could bedriven by different drive systems in the floor 250, the walls 252, 254above in line with or below the slot openings or in the cover 256 of thechamber.

Referring now to FIG. 13A, there is shown a portion of chamber 716 ofthe apparatus 10, and a top view of an exemplary drive system 701 withan exemplary cart 700 that may be used with the apparatus. Chamber 716is another representative portion of chamber IS, or chambers 602-624 ofthe apparatus (see FIGS. 2-3, and 7-7A). Cart 700 is shown as beingcapable of transporting substrates 702A, 702B along an axial path 704and/or a radial path 706 or in a Z motion (not shown—in and out ofpaper). In alternate embodiments, angular motion could be provided. Inalternate embodiments, more or less substrate handling could beprovided. Cart 700 has transport mechanisms 724A and 724B which can be alinear mechanism or any suitable arm system may be used such as, forexample, a scara type arm. In alternate embodiments no arm may beprovided. Transport mechanisms 724A and 724B may extended into processmodules or other modules as desired in a manner similar to that shown inFIG. 12A. Cart 700 has platens 722, 720, 710 and 712 on its sides whichinterface with synchronous motors in the walls of transport chamber 716.Drive platen 712 is mounted on the side of cart 700 and is slideablerelative to cart 700 along direction 704. Platen 712 drives mechanism724A such that the movement of platen 712 along direction 704 (fromlocation 712A to 712B, see FIG. 13A) relative to cart 700 allowsmechanism 724A to transport wafer 702A between location 708A and 708Bthrough slots 718A and 718B. Similarly, drive platen 710 is mounted onthe side of cart 700 and is slideable relative to cart 700 alongdirection 704. Platen 710 drives mechanism 724B such that the movementof platen 710 along direction 704 (from location 710A to 710B, see FIG.13A) relative to cart 700 allows mechanism 724B to transport wafer 702Bbetween location 708A and 708B through slots 718A and 718B. Platens 710and 712 are independently moveable relative to cart 700. Platens 722,720 are fixed relative to cart 700. Holding platens 720, 722 stationarywhile simultaneously moving platen 712 along direction 704 causes aradial transfer motion along direction 706. Holding platens 720, 722stationary while simultaneously moving platen 710 along direction 704also causes a separate radial transfer motion along direction 706.Simultaneously moving platens 720, 722, 710 and 712 along direction 704causes cart 700 to move along direction 704 enabling the cart 700 tomove from process location to process location as through valve 714 forexample.

Referring now to FIG. 13B, there is shown a section view of theexemplary drive system 701 and cart 700 taken along line 13B-13B in FIG.13A. Referring also to FIG. 13C, there is shown another side sectionview of the exemplary drive system 701 in FIG. 13B. System 701 hasopposing stationary winding sets 727, 729 that drive cart 700. Windingsets 727, 729 are wound in a combination of one and two dimensionaldriving arrays, for example, vertical 705 and lateral 704. The drivingarrays may be linear motors or linear stepping type motors in one or twodimensional arrays. Examples of such driving arrays are described inU.S. Pat. Nos. 4,958,115, 5,126,648, 4,555,650, 3,376,578, 3,857,078,4,823,062, which are incorporated by reference herein in their entirety.In alternate embodiments, integrated two dimensional winding sets couldbe employed with platens having two dimensional magnets or patterns. Inother alternate embodiments, other types of one or two dimensional drivesystems could be employed. In alternate embodiments, additional arrayscould be provided to drive cart 700 in different directions, for exampleby coupling system 701 to another similar system oriented 90 degreestherefrom. The arrays are driven in multiple zones in order to allowmultiple carts to be driven independently. As an example, zone 685 couldbe a supply zone, zone 683 could be a transfer zone, and zone 681 couldbe a return zone. Within each zone may be sub-zones which allow drivingmultiple carts within each zone. In alternate embodiments, more or lesszones or sub-zones may be provided in any of a number of combinations.Cart 700 is supported by the fields produced by winding sets 727, 729and is positionable in a levitated and non-contact manner by biasing thefields between winding sets 727 and 729. FIG. 13C shows one possiblewinding combination that could be driven by the system shown in FIG. 13Dand employed to levitate cart 700 (as for example as discussed furtherbelow with reference to FIG. 14A, or through multiple axis activelevitation). One dimensional winding sets. are provided in winding zones732A-C and 730A-C and 734A-C and 742A-B and 740A-B. Two dimensionalwinding sets are provided in winding zones 736A-E and 738A-C. Inalternate embodiments, any suitable combination of winding sets could beprovided or a full 2-D array or otherwise could be provided. Cart 700has platens 720 and 710 which may be used in combination with arrays738B for platen 720 and arrays 736B, C and D for platen 710. By movingplaten 710 in direction 704 (see FIG. 13A) and holding platen 720stationary, a wafer may be radially moved through slot 718A. Bysimultaneously moving 710 and 720 in direction 70S (see FIG. 13B), awafer may be picked or placed. By coordinating winding commutation andwinding switching between zones, cart 700 may selectively be movedvertically and/or laterally through the different winding and drivezones. Chamber 716 may be provided as a barrier between winding sets727, 729 and cart 700. In alternate embodiments, no barrier need exist,such as in the event that, winding sets 727, 729 are inside theenclosure 716 where there is for example a clean air or nitrogenenvironment. In alternate embodiments, more or less platens or windingsmay be provided. Arrays of sensors 746, 747, 748 may be provided forsensing the presence of the magnets in the platens or the platens or thecart (s) for determining proper commutation and location and for fineposition determination of the platens and the cart, or for determiningpositions, such as the gap between platens and windings. A cartidentification tag, as noted before, may be provided with a readerprovided at appropriate stations to determine cart id by station.

Referring now to FIG. 14A there is shown an end view of anotherexemplary cart 760, in accordance with yet another embodiment, supportedby the fields produced by single axis linear motor winding sets 762,764. Exemplary cart 760 is positionable in a non-contact manner bybiasing 776 the fields between winding sets 762 and 764. Positionsensing 766, 768 is provided, in a close loop fashion with biasing 776,to levitate cart 760. Levitation may be accomplished in this simplemanner as the cart is passively stabilized in the Z direction as shownin FIG. 14B. Cart 760 has magnetic platens 772 and 774 on its sideswhich may have magnets or be made from magnetic or conductive materialswhich interface with winding sets 762, 764. In alternate embodiments,more or less platens could be provided, driving arms for example.Chamber 770 (similar to any representative portion of the chambers 18,602-624 of the apparatus, see FIGS. 2-3, and 7-7A) may be made from anonmagnetic material, for example non-magnetic stainless steel andprovide a barrier between the motor windings and their respectiveplatens as described before. In alternate embodiments, more or lesslinear drives or carts may be provided. For example, a single drivemotor may be provided having additional drive zones where platens wouldinterface with the same drive motor but be independently driveable bythe different zones. As a further example, additional carts could bedriven by different drive systems in the floor, the walls above in linewith or below slot openings or in the covers of the chamber.

In FIG. 14B the relationship between the restoring force F and the axialdeflection Z from the desired position of cart 760 is graphicallyillustrated. In the respective positive or negative axial direction (zdirection) the restoring force first increases in magnitude to a valueFMAX or −FMAX respectively up to a maximal deflection ZMAX or −ZMAXrespectively, but decreases again however when this deflection isexceeded. Therefore, if a force is applied to cart 760 (such as cartweight or external forces, such as from other winding sets that drivethe same or other platens or otherwise) that exceeds FMAX, then the cartescapes from the windings 762, 764. Otherwise, cart 760 will stay withinthe fields as long as they are applied. This principle, described in USpatent references (which are hereby incorporated by reference in theirentirety) U.S. Pat. Nos. 6,485,531, 6,559,567, 6,386,505, 6,351,048,6,355,998 for a rotary devices is applied in the drive system 701, ofthe apparatus described herein, in a linear fashion to levitateexemplary cart 760. In alternate embodiments, other drive systems orlevitation systems may be used.

Referring again to FIG. 13D, there is shown a diagram of an exemplarywinding drive system 790 suitable for use with cart/platen drive system701 in FIG. 13A. Winding drive system 790 has windings 792, multiplexer793 and amplifier modules 794. Windings 792 may have windings and/orsensors such as hall sensors, positions sensors, inductive sensors,carrier identification sensors, status and fault detection logic andcircuitry or otherwise. Amplifier modules 794 may have single ormultiple phase amplifiers, position and/or presence sensor inputs oroutputs, CPUs and/or memory, identification reader inputs or outputs,status and fault detection logic and circuitry or otherwise. Amplifiermodules 794 may connect directly to windings 792 or through multiplexerunit 793. When using multiplexer unit 793, amplifiers Al-Am may beselectively connected to any of windings Wl-Wn. A CPU coordinates thisselective connection and monitors the status of the devices. In thismanner, the CPU may selectively take amplifier modules or windings offline for service without shutting down the tool.

As noted before, the, transport apparatus or carts suitable for use inthe transport chambers 18, 602-624 (see for example FIGS. 2-3 and 7-7A)may comprise carts with or without a transfer arm for transferringsemiconductor workpieces between the cart and a desired location in theapparatus. FIGS. 12 and 13A respectively show, as described before, two,exemplary embodiments of transport carts 229, 700 with transfer arms forhandling semiconductor workpieces in the apparatus. Referring now aheadto FIGS. 22 and 23, there is shown another embodiment of a transportcart mechanism 1557 suitable for use in the chambers of apparatus 10.Cart 1557 may include base section or base plate 1558 and transfer arm1577 mounted to the base plate. As shown in FIG. 22, the cart mechanismbase plate 1558 with two coupled magnet arrays 1502 on opposite sides ofthe plate, but not limited to opposite corners of the plate. On theopposing corners of the robot base plate 1558, two addition magnetarrays 1502 are coupled to linear bearing carriages 1560 and are made toslide on linear bearing rails 1562. These linear bearing rails 1562 arecoupled to the base plate 1558. A drive belt 1564 or other means ofconverting linear motion to rotary motion is attached to the linearbearing carriage 1560. In the case shown, the drive belt 1564 is wrappedaround an idler pulley 1566 and then a pulley tensioner 1568 andattached to a drive pulley 1570. The linear motion applied to thebearing carriage 1560 through the magnet array 1502, will result inrotary motion of the driven pulley 1572. In the case of a two degree offreedom application, a redundant version of the mechanism described isapplied to the opposite side of the robot cart mechanism and a duplicatecircuit is attached to drive pulley 1572. This combination yields aconcentric pulley assembly. The relative motion between the fixed magnetarray 1502 and the combined magnet array 1502 and linear bearingcarriage 1560 provides a means of driving the transfer arm linkage. Inthe case of linear transport of the robot carriage, the linearbearing/magnet array 1560/1502 and the coupled magnet array/cart baseplate 1502/1558 are driven as a fixed set and no rotation of the drivenpulleys 1570 & 1572 is seen. The drive mechanism of base plate 1558 maybe used for operating other suitable transfer arm linkages, someexamples are shown in FIGS. 24-24C, 25-25C). The transfer arm 1577 inthe embodiment shown in FIG. 23, has a general single SCARA armconfiguration. Drive pulley 1572 is coupled to the lower link arm 1574and drive pulley 1570 is tied to forearm drive pulley 1586. The rotationmotion of the forearm pulley 1586 is coupled to the forearm 1578 throughthe drive belt 1582 and the elbow pulley 1576. The wrist/end effector1584 is driven by the resulting relative rotation motion of the forearm1578 with respect to the wrist elbow pulley 1580 as it is grounded tothe lower link arm 1574. Typically, this motion is achieved by thepulley ratio at each joint with respect to the input drive ratio ofpulleys 1572 and 1570. Referring also to FIGS. 23A-23B, the transfer armlinkage 1577 is shown respectively in retracted and extended positions.The movement between retracted and extended positions is achieved (in amanner as described above) by moving the movable magnet arrays 1502 asdesired relative to the base plate. The movement of the arm linkage maybe performed with the cart stationary or moving relative to thetransport chamber. FIGS. 23A-23B show the transfer arm 1577 positionedso that when extended the arm 1577 extends to the lateral side 1576R(i.e. the side of the cart facing a chamber wall) of the cart. This issimilar to the extension/retraction movement of the transfer mechanism724A, B of cart 700 in FIG. 13A. As can be realized, the transfer arm1577 on cart 1557 may be 25 rotated as a unit (using movable magnetarrays 1502) about axis of rotation S (see FIG. 22) to any desiredorientation relative to the cart base plate. For example, if rotatedabout 180° from the orientation shown in FIGS. 23A-23B, the transfer arm1577 may be extended to the opposite side 1575L from that shown in FIG.23B. Further, the transfer arm may be rotated about 90° so that the armextension is along the linear direction of the chamber (indicated byarrow 15X in FIG. 22). Any number of arm linkages may be employed withsuch a cart. Other examples of suitable arm linkages that may be usedwith the cart are described in U.S. Pat. Nos. 5,180,276; 5,647,724;5,765,983; and 6,485,250 all incorporated by reference herein in theirentirety.

FIG. 24 is an elevation view of another embodiment of the cart mechanism1557′ with dual rotary end effectors mounted to the cart base plate1558′. Cart 1557′ is otherwise similar to cart 1557 described before andshown in FIGS. 22-23. Similar features are similarly numbered. FIGS.24A-24C show the use of both linear transport and couple relative motionof the bearing carriage array as the cart is moving. As described beforewith reference to FIG. 22, the rotation of pulleys 1570′ and 1572′results from the bearing carriage and magnet array moving with respectto the fixed magnet arrays which are coupled to the cart's base plate.In the combined case, the robot cart transport is moving along thelinear chamber, in the direction indicated by arrows 15X′, and thebearing carriage and magnet array move with respect to the groundedarrays. This motion enables the end effector(s) 1588′ and 1590′ torotate thereby causing the robot end effector to extend substantiallyperpendicular to the linear direction of the cart similar to FIGS.23A-23B, described before. FIGS. 24A-24C show the end effectors 1588′and 1590′ extended to one side for example purposes. As can be realizedhowever, the end effectors 1588′, 1590′ may be extended to any side ofthe base plate. Further, the end effectors 1588′, 1590′ may be extendedto a position where the end effector is oriented at an angle more orless than about 90° as shown in FIGS. 24A-24C.

FIG. 25 is a schematic elevation view of still another embodiment of thecart 1557″, having and arm linkage similar to that shown in FIG. 23. Inthis case, the drive pulley 1572″ is attached to the lower link arm1592″. The driver pulley 1570″ is coupled to the end effector driverpulley 1600″ and, coupled to the elbow pulley 1596″ through a drive belt1598″. The elbow drive pulley is attached to the robot end effector1594″ and provides a means of transmitting the rotation of driver pulley1570″ to the driven end effector 1594″. FIGS. 25A-25C show the cart withthe arm linkage in three different positions. FIGS. 25A-25C show the endeffector 1594″ extended to one side of the base plate 1558″ of the cartfor example purposes only. Similar to the transfer arms shown in FIGS.22-23 and 24, the transfer arm 1577″ may be rotated about axis S″ sothat the end effector may be extended/retracted in any directionrelative to the base plate 1558″ of the cart 1557″. With reference nowalso to FIGS. 2-7A, a significant advantage of using carts (such ascarts 22, 122A, 406, 229, 700, 1557, 1557′, 1557″ shown in FIGS. 12,13A, 22, 23, 24, and 25) with articulate transfer arms is that for agiven reach of the transfer arm, the transfer chamber may be providedwith the minimum width. The multi-axis articulation of the transfer armson the different cart embodiments, allows substantially independentplacement of the cart relative to the path of the articulating arm,which in turn allows the width of the transport chamber 18 to be reducedto a minimum. Similarly, the width of slot valves and passagesconnecting storage processing modules to the transport chamber may bereduced to minimum size.

Referring now to FIG. 15, an exemplary wafer aligner 500 for use withapparatus 10 is shown. The wafer aligner carrier 500 may generallyinclude two parts, wafer chuck 504 and the wafer transport carrier 502.The aligner provides wafer alignment and movement within the linearcartesian transport tool. The aligner is made to interface with thetransport cart (s) in the apparatus (such, as for example carts 22,122A, 406, 700, 1557) or in some cases may be included in the robot cartof the linear process tool architecture.

Referring also to FIG. 16, the wafer chuck 504 is shown to be able toseparate from the wafer transport carrier 502. Friction pads may couplethe two devices during transport throughout the linear Cartesianapparatus. When disassembled, the wafer chuck 504 is free to rotate withrespect to the wafer transport carrier 502. The wafer chuck 504 providesa means of passive wafer edge support by using angle ramped wafer edgepads 508 with respect to the substrate (wafer) 506. An additionalfeature as part of the wafer chuck 504 is the relief beneath the wafer506 for the ability of the robot arm cart to remove and place the waferonto the wafer carrier 500. This is identified as wafer removalclearance zone 510.

This method of wafer rotation with respect to the linear transport cartcan be applied directly to the robot's end effector. This method isshown in FIG. 17. The robot arm cart 534 is configured so that the waferchuck 504 is removable from the robot's end effector 536. In this case,the chuck is free to be rotated to correct for any slight wafer notchorientation requirements based on drop off point changes found in theprocess modules or load locks.

Referring also to FIG. 18, the wafer chuck rotation device 532 is shown.At multiple points within the linear transport tool, these rotationalwells can be deployed. This device is based on motor isolationtechniques found in U.S. Pat. No. 5,720,590 which is hereby incorporatedby reference in its entirety. In alternate embodiments, a conventionalmotor and seal combination may be used. A stationary motor 522 ismounted to the linear transport chamber's base 530. A vacuum isolationbarrier 520 is placed between the motor armature 540 and the magnetarray 524. The magnet array is mounted directly to the rotation shaft542. This allows for direct drive coupling into the vacuum system. Apossible support bearing 518 may be required but ideally, magneticsuspension is used. An optical encoder disc 526 is attached to therotation shaft 542 with the read head 528 placed in a location toprovide position feedback to the controller for the rotation shaft's 542angle. The aligner chuck 504 is lowered onto the friction pads orkinematics pin(s) 516. These pads/pins provide a means of wafer chuck504 rotation once the wafer chuck 504 is disconnected from the wafercarrier 502 or the robot's end effector 536. This same means ofproviding rotation can be applied to control the rotational position ofa robotic arm link 538 applied as part of the robot arm carrier shown inFIG. 17.

Referring also to FIG. 19, the wafer transport carrier 500 consisting ofthe wafer chuck 504 and the wafer transport carrier is moved to aposition above the wafer chuck rotation device 532. In FIG. 20, thewafer transport carrier is lowered such that the wafer chuck 504 islifted off on the transport carrier 502. A camera 544 located in thetransport's chamber lid 546 is able to look at the image of the waferand identify the wafer's x-y position and the location angle of thewafer's notch. The wafer carrier can then be moved to provide x-ylocation change of the wafer chuck 504 with respect to the wafertransport carrier 502 and rotation can be provided to correct for notchalignment. Another option for the wafer chuck rotational drive when usedas a method of robot arm carrier device is to allow rotationalengagement while extending the robot link arm and requiring verticalaxis of motion to allow for the substrate or wafer to be lowered/raisedfrom the process module or load lock. A method of this approach isschematically shown in FIG. 21. A stationary motor 522 is mounted to aguided plate 548. The guided plate is attached to the linear transportchamber's base 530 via a metal bellows 550 or other linear isolationseal (lip seal, o-ring, etc.). A vacuum isolation barrier 520 is placedbetween the motor armature 540 and the magnet array 524. The magnetarray is mounted directly to the rotation shaft 542. This allows fordirect drive coupling into the vacuum system. A possible support bearing518 may be required but ideally, magnetic suspension is used. An opticalencoder disc 526 is attached to the rotation shaft 542 with the readhead 528 placed in a location to provide position feedback to thecontroller for the rotation shaft's 542 angle. An additional guideroller 552 and the supporting structure 554 with end of travel stop 556allow the rotation drive to be held positioned as required to engage thewafer chuck or robot arm rather than using the linear wafer transportcarrier 500 as the actuation device. In the case where the transportchamber is pressurized resulting in a state where the robot drive ispositioned up, the force of the bellows will act as a spring and allowsthe rotational device to be engaged with various linear robot arm cartvertical elevations (such as during a pick or place) but over apractical limited vertical travel range. Once the device is engaged thefriction pads or kinematics pin(s) 516. These pads/pins provide a meansof wafer chuck 504 rotation once the wafer chuck 504 is disconnectedfrom the wafer carrier 502 or the robot's end effector 536 as shown inFIG. 20. This same means of providing rotation can be applied to controlthe rotational position of a robotic arm link 538 applied as part of therobot arm carrier shown in FIG. 17.

Systems, such as those shown in FIGS. 2-7, may be controlled byconfigurable and scaleable software stored in controller C. Referringnow also to FIG. 26, there is shown manufacturing execution (“MES”)system software that may be provided in the controller C communicablyconnected to the processing system. The MES system 2000 comprisessoftware modules 2002-2016 or options that enhance the capabilities ofthe MES. The modules include a material control system (“MCS”) 2002, areal time dispatcher (“RTD”) 2004, a workflow or activity manager (“AM”)2006, an engineering data manager (“EDA”) 2008 and a computermaintenance management system (“CMMS”) 2010. The MES 2002 allowsmanufacturers to configure their factory resources and process plans,track inventory and orders, collect and analyze production data, monitorequipment, dispatch work orders to manufacturing operators, and traceconsumption of components into finished products. The MCS softwaremodule 2002 allows the manufacturer to efficiently schedule individualcarts (for example, carts 22, 122A, 406, 228, 700, 1557 in FIGS. 2-3,7-7A, 12, 13A and 22) to arrive at the processing tools to maximizeoverall system efficiency.

The MCS schedules when an individual cart will arrive at, and departfrom, a specified processing tool (for example, process 18A, 18B in FIG.7, and modules 602-626 in FIG. 7A). The MCS manages any queuing androuting requirements at each processing tool and optimizes the systemyield while minimizing the cart transport cycle time. The RTD 2004allows manufacturers to make cart routing decisions, in real time, basedon feed back from the health of the processing tools. Additionally, cartrouting decisions may be made by the MES operator. The MES operator maychange the priority in which specific products need to be manufactured.The AM 2006 allows manufacturers to monitor the progress of any givencart containing one or more substrates though the entire manufacturingprocess. If a processing tool generates an error, the AM 2006 determinesthe best remaining route for the all the substrates being processed atthe processing tool. The EDA 2008 allows manufactures to analyze themanufacturing data and execute statistical process control algorithms onthat data in an effort to improve the efficiency of the processing tool.The CMMS 2010 system allows the manufacturer to predict when maintenanceis required on an individual processing tool. Variances in the processof the processing tool is monitored and compared against known processresults and changes to the process or scheduled repairs to theprocessing tool is predicted.

Referring now to FIG. 27, there is shown a substrate processing system3010 in accordance with yet another exemplary embodiment of theinvention. The system 3010 in FIG. 27 is generally similar to processingsystems and tools 10, 10′, 18, 18A, 18B, 601 described before and shownin the drawings, except as otherwise noted below. Similar features aresimilarly numbered. System 3010 generally includes substrate processingtool 3014 and in this embodiment tool interfaces 3012 and 3016. As inthe previous exemplary embodiments, tool 3018 has a controlledatmosphere and is isolated from the outside atmosphere. The toolinterfaces 3012, 3016 generally provide an interface between the tool3014 and other cooperative systems in the fab. For example, toolinterface 3012 may be an EFEM suitably configured for interaction with afab mass substrate transport system 3001, such as automated guidedvehicles, or other desired automated material handling system. The EFEM3012 may be able to allow or provide for loading and offloading ofsubstrates between the mass transport system 3001 and EFEM, and holdunprocessed substrates for entry (in the direction indicated by arrow3000S) into the processing tool 3018. The EFEM 3012 may also be capableof receiving from the processing tool 3018 (in the direction indicatedby arrow 3000P), processed substrates for return transfer to the fabtransport system 3001. As noted before, in this embodiment system 3010has another tool interface 3016, such as an environmental second endmodule (ESEM), at the opposite end of the tool 3018 from EFEM 3012. ESEM3016, in this embodiment, is substantially similar to EFEM 3012, capablefor example of receiving processed substrates from the tool 3018 (in thedirection indicated by arrow 3000P in FIG. 27) and able to facilitatesubsequent transfer of the substrates to an adjoining portion of fabtransport system 3001. If desired, ESEM 3016 may also be used to feedunprocessed substrates to tool 3018. In alternate embodiments, theprocessing system may have a tool interface at but one of the tool ends.In that case, unprocessed substrates would be input, and processedsubstrates would be output, throughout the one end of the process toolwhere the tool interface is located. In other alternate embodiments, thetool may interface or be otherwise connected directly to another tool orto a transport chamber having a controlled atmosphere (such as in amanner similar to that shown in FIG. 7A for transport. chambers,602-626). Still referring to FIG. 27, tool 3018 generally comprises asubstrate transport chamber 3014 and process modules 3020, 3020A. Asnoted before, chamber 3014 may have a controlled atmosphere such as avacuum or inert gas and may be isolated from the outside atmosphere.Transport chamber 3014 may have different sections 3014A, 3014B, 3014C,capable of being isolated from each other such that each section may becapable of holding a different controlled atmosphere (e.g. vacuum, nearhigh vacuum, high vacuum). As seen in FIG. 27, the transport chamber3014 has a generally linear shape. The process modules 3020, 3020A aremounted in this embodiment to the lateral sides of the transport chamber3014. The process modules 3020, 3020A may be similar or different fromeach other. For example, the processing tool 3018 may have one or moreload lock chamber modules 3020A (in the embodiment shown in FIG. 27there are four load lock chamber modules 3020A, two of which communicatewith each tool interface 3012, 3016) as desired to allow transfer ofsubstrates into and out of the tool (in the direction indicated byarrows 3000 I/O) without affecting the controlled atmosphere in thetool. The other process modules may be configured to perform desiredprocessing on substrates in the tool, such as dielectric or metaldeposition, etching, ion implantation, rapid thermal processing,chemical or mechanical polishing, metrology and others. The processmodules, are connected to the sides of the transport chamber 3018 toform a seal with the chamber and maintain the controlled atmosphere inthe chamber. The process modules 3020 may be arranged in any desiredorder along the chamber 3014, such as for example to provide a desiredserial processing sequence when substrates progress through the tool indirection 3000S. As will be described further below, tool 3018 does notlimit the process sequence, to which substrates are subjected, to merelythe serial order of the process modules arrangement on the tool, butrather allows selectability of the process steps. In alternateembodiments, the process modules of the tool 3018 may each providesubstantially the same process. As seen in FIG. 27, the tool 3018 has atleast one transport vehicle or cart 3229 located in chamber 3014, andcapable of holding one or more substrates thereon. The cart 3229 iscapable of linear traverse inside the chamber 3014 (in the directionindicated by arrow 3000X). The cart 3229, as will be described below,may also have a suitable operable substrate transfer device 3160 fortransferring substrates between the cart, inside the transport chamber3014, and the process modules 3020, 3020A (in the direction indicated byarrow 3000Y in FIG. 27). The cart 3229 in this embodiment is passive,without motors or powered systems. The transport chamber 3014 includes adrive system 3400 that interfaces with the cart to move the cart withinthe chamber (direction 3000X) and effect operation of the cart substratetransfer device 3160 to transfer substrates (indicated by direction3000Y). The transport chamber 3014 may also include a position feed backsystem 3336 for identifying the position of the cart 3229 and substrate.The drive system 3400 and position feed back system 3336 are operated bythe CPU to move the cart and transfer substrates in order to select anydesired process sequence for the substrates processed by the tool. Asseen in FIG. 27 the transport chamber 3014 is formed by modules 3016,3016A, 3016B, 3016C that are abutted to each other. As will be describedbelow, each module 3016, 3016A, 3016B, 3016C is a self contained unitwith integral drive system and, position feed back system portion toallow each module to operate as an individual transport chamber, and toallow integration of any desired number of modules to form the transportchamber 304 of desired length.

The transport chamber modules 3016, 3016A, 3016B, 3016C forming thetransport chamber 3014 are generally similar to each, other. Thetransport chamber modules 3016, 3016A, 3016B, 3016C may have differentlengths, and different numbers of connections for connection of anydesired number of process chamber modules to each transport chambermodule. Though in the embodiment shown in FIG. 27, each transportchamber module is capable of having a process chamber module 3020, 3020Aconnected to each side of the transport chamber module, in alternateembodiments transport chamber modules may be configured to interfacewith multiple process chamber modules similar to modules 3020. Thetransport chamber modules 3016, 3016A, 3016B, 3016C are interchangeableso that the chamber modules may be joined together in any desiredsequence to form the transport chamber. FIGS. 28 and 29 are crosssectional views of an exemplary transport chamber module 3016 (FIG. 29further shows portions in phantom of adjacent transport chamber modules3016, 3016A when abutted/mated to the chamber module 3016). As notedbefore, the transport chamber modules 3016, 3016A, 3016B, 3016C aresubstantially similar. Chamber module 3016 has a frame 3016F, which maybe of any suitable shape and made of any suitable material. The frame3016F may have removable panels or sections, such as for exampleremovable top panel 3016T. The removable panel 3016T is mounted to therest of the module frame 3016F to allow removal from the module when themodule is connected to other modules forming the chamber. This allowsaccess to components/cart inside the module without removal of theentire module from the chamber. Access panel 3016T may be sufficientlylarge to allow insertion/removal of the cart 3229 through the resultantopening 30160 in the chamber module frame. A seal 30168 is provided atthe interface of the panel 3016T and frame to prevent compromise of thecontrolled atmosphere in the transport chamber 3014. As seen in FIG. 28,the frame has ports 3016P formed therein for communication with theprocess chamber modules 3020. As may be realized, the ports 3016P aresized and shaped to allow the substrate transfer device 33060 with thesubstrate S thereon to pass through the port into the process module.The ports 3016P may be closable by suitable valves or doors that may beintegrated into the transport chamber module frame 3016F, or may bemounted on the process module. As seen in FIG. 29, the frame 3016F hassuitable interface features 3016I at the opposite longitudinal ends forsealably mating the module 3016 to adjoining modules 3016A, 3016. Theinterfaces 3016I may be of any suitable type. By way of example, theinterfaces 3016I may have suitable seating features complementing matingfacets of the adjoining module interface to allow proper abutment of theadjoining modules. Fasteners, such as mechanical fasteners, or othersuitable clamping or retention features may be included to capture themodules to each other. The interfaces 3016I₁, 3016I₂ may includepolarization facets to establish a desired orientation of the chambermodules 3016, 3016A when being joined (and preventing abutment andconnection therebetween when the module is not in the desiredorientation) the interface features 3016I₁, 3016I₂ are common to eachmodule allowing the modules to be interchangeable as noted before. Theframe 3016F, in this embodiment defines a chamber space sufficient forcart 3229. Minimum clearances may be provided around the cart to allowfree movement of the cart through the module. The end openings 3016R inthe module frame are sized to allow the cart 3229 (holding a desirednumber of substrates S) to pass through the opening, and traversebetween modules 3016, 3016A. The end openings 3016R may be closed bydoors 3016D. The doors 3016D may be integral with the module frame, ormay be installed as an additional modular portion between chambermodules when the chamber modules are joined together.

As seen in FIGS. 27-28, the module has support or guide rails 3040 forcooperating with slides 3240 on the cart, movably support the cart 3229in the chamber. In this embodiment, the rails 3040 are located on thebottom of the module (under the cart), though in alternate embodimentsthe rails may be attached to any desired portion of the chamber moduleframe. In this embodiment, two rails 3040 are shown, but more or fewerrails may be used. The rails 3040 are shown as extending continuouslythrough the module. The rails 3040 terminate at a distance 3040D fromthe interfacing face of the module 3016 sized so that, when the cartpasses between modules 3016, 3016A, the slides 3240 on the cart maytraverse the distance 3040D (in each module) and commence riding on therail of the adjacent module 3016, 3016A without disturbance to thestable attitude of the cart. Conversely, as may be realized the slides3240 of the cart 3229 are sized to continue to provide stable support tothe cart when the cart passes between modules 3016, 3016A and the slides3240 traverse from the rails 3040 in one module 3016, 3016A to theadjoining rail segments in the adjoining module.

Still referring to FIGS. 27-28, the module 3016 has an integral portionof the cart drive system 3400. In this embodiment, the system is alinear electrical motor, though in alternate embodiments any suitabletype of electric or mechanical drive system may be used such as a cabledrive. In the embodiment shown in FIGS. 28-29, the drive system is acoreless linear drive system, such as coreless linear motors availablefrom Tecnotion or Anorad. In FIG. 29, the drive system portion integralto the transport chamber module 3016 is shown as having three sets ofwindings 3402, 3402A, 3402B, 3404, 3404A, 3404B on each side of themodule. As seen in FIG. 28 each set of windings 3402, 3404 cooperateswith a corresponding platen 3168, 3172 on the cart 3229. The windings3402, 3404 may be of any desired length, including commerciallyavailable standard lengths. In alternate embodiments, any desired numberof windings may be used to drive the cart platens on each side of thechamber. As seen in FIG. 28, the coreless motor windings 3402, 3404project into the chamber to interface with the platen 3168, 3172 of thecart. In alternate embodiments, the linear motor may be an iron corelinear motor similar to the motor 400 described before and shown inFIGS. 11A-11B. In that case, the motor windings may be isolated from thechamber by interior frame portions similar to portions 414 in FIGS.11A-11B. The windings 340L, 340SA, 3402B, and 3404, 3404A, 3404B on eachside of the module are arranged respectively along a single axis,thereby providing one drive axis on each side. In alternate embodiments,windings may be positioned to provide multiple drive axes on each side.In other embodiments, for example as in the case where iron core linearmotor windings are used, the windings may be arranged to provide driveaxes in both X and Z directions (i.e. both linear along the chamber, aswell as vertical drive axes, for shunting the cart between longitudinaldrive axes, similar to the winding arrangement described before andshown in FIGS. 13B-13C). Windings 3402-3402B, and 3404-3404B, along eachdrive axis, are also sized and positioned relative to the moduleinterface 3016I₁, 3016I₂, to maintain, in cooperation with the next mostproximate windings 3400B in the abutting module 3016, a continuouspropulsive force on the platens traversing the interface region of theabutting modules, enabling the cart to traverse from one module 3016,3016A to the other. A control system 3790, controlled by the CPU isprovided to control operation of the windings. Though in FIG. 29, onlyone set of drive axis windings 3402-3402B of the module 3016, is shownas being connected to the control 3790, both sets of windings arecontrolled in a similar manner. The winding control system 3790 isgenerally similar to winding control system 790, described before andshown in FIG. 13D. The winding control or drive system 3790, maygenerally have a multiplexer 3793 and amplifier modules 3794. Theamplifier modules 3794 may be connected via multiplexer 3793 to drivewindings 3402, 3402A, 3402B along each drive axis in the desiredsequence for moving the cart platens. The sequencing and connection ofthe amplifiers to the windings is controlled by the CPU. The CPU maycommunicate with the position feed back system 3336 of the module, aswill be described further below, to determine the amplifier connectionand drive sequence of the windings. The winding control system 3790 maybe a discrete system dedicated to the module 3016. For example, thecontrol system 3790 may be carried, mounted or otherwise incorporatedwith the module 3016 (the control system 3790 need not be positioned onthe module frame, and may be enclosed in a separate housing (not shown)if desired). The control system 3790 may communicate with the windings3402, 3402A, 3402B through suitable communication lines penetratingthrough the chamber when using suitable feed through. In FIG. 29,dedicated communication lines are shown individually passing through thecharger walls, for example purposes, and the communication lines may beconsolidated to allow a minimum number of feed through penetrations inthe chamber walls. The control system 3790 may include a suitablecoupling 3790C, allowing the control system 3790 to be connected to theCPU upon assembly of the tool. As seen in FIG. 29, the module 3016 mayhave another wiring 3401C (for example mounted or situated on a side ofthe module) for coupling the communication lines of the windings to thecontrol system 3790. Coupling 3401C may also allow the windings to beconnected to a central winding control system of the process tool in acase where a dedicated module winding control system is not desired.

Referring now to FIG. 30, here is shown a bottom view of the cart 3229.The cart may have any suitable configuration. In this embodiment, thecart is substantially similar to cart 229 described before and shown inFIG. 12-12B. As noted before cart 3229 has two platens 3168, 3172.Platens 3168, 3172 have permanent magnets or magnetic material, and areconfigured for operation with the coreless linear windings 3402, 3404 asshown in FIG. 28. Platen 3168 in this embodiment is fixedly mounted tothe cart frame 3156. Platen 3172 is movably secured, such as by keyedslides 3156S, to the frame 3156 of the cart. Platen 372 is thus capableof limited movement relative to the cart frame 3156 (in the directionindicated by arrow 3229X shown in FIG. 30). Fore and aft stops limit themotion of platen 3172 relative to the frame. Similar to platen 172 ofcart 229, described before, the additional mobility of the platen 317Lrelative to cart 3229, provide the cart with a further degree of freedomthat is converted to operate the substrate transfer device 3160 in orderto extend and retract. Substrate transfer device 3160 is substantiallysimilar to the telescoping sections 158, 160 of cart 229 (see FIGS. 12A,12B). Hence, transfer device 3160 may include any suitable number oftelescoping sections, terminating with an end effector, similar to endeffector 158 described before. The transfer device 160 may be connectedby a suitable transmission system, similar to the system of cart 229, tothe movable platen 3172 to convert the relative movement of the platento movement of the transfer device 3160 (and hence movement of thesubstrate in the direction indicated by arrows 3000Y1, 3000Y2 in FIG.28) (Z axis) may be generated by deenergizing/energizing the windings3402, 3404 and raising/lowering the cart to pick/place the substrate S.In alternate embodiments, the substrate transfer device of the cart maybe of any suitable type such as for example a scara type arm, having oneor more articulated sections. Further independent degrees of freedom,for independent motion of various transfer device sections may beprovided by adding additional platens to the cart that are mounted to beindependently movable relative to the cart similar to platen 3172. Inalternate embodiments, the cart may be similar to cart 1558, describedbefore and illustrated in FIGS. 22-23, or may be similar to carts 1558′and 1558″ shown respectively in FIGS. 24, 24A-24C and FIGS. 25, 25A-25C.

Referring now again to FIGS. 28-29, as noted before, the transportmodule chamber 3016 also has an integral position feed back system 3336for determining and controlling the position of the platens/cart in themodule. In the embodiment shown in FIGS. 28-29, position feed backsystem 3336S may be capable of fine precision determination, such ashaving a positioning resolution and accurately in the range of about 1-5μm. The module 3016 may have another position feed back system 3340capable of gross or rough position determination, such as having apositioning resolution and accuracy of about 10-20 μm. The fine positiondetermination system 3336 may be a linear electric encoder system.Suitable linear encoder systems are available from Netzer PrecisionMotion Sensors, Ltd., or from Farrand Corp. In alternate embodiments,the module may have any other suitable type of position determinationsystem capable of fine precision determination, such as electro-opticalencoders, or magneto-restrictive type Hau effect sensing system. In thisembodiment, the fine positioning system 3336 may include a linear scale3336S. The linear scale 3336S is mounted to the bottom surface of themodule frame 3016F to interact with passive sensor registration featuresN1-N4 (see FIG. 30) on the cart 3229. In alternate embodiments, thescale may be positioned on any other portion of the module placing thescale in a suitable position for sensing the registration features onthe cart. The scale 3336S, which is illustrated schematically in FIGS.28-29 is an electrically active element, excited from a suitable ACsource (not shown) via suitable communication line 3336C. For example,the scale may include one or more printed circuit, strips on whichperiodic pattern field transmitter is printed. In this embodiment, thescale 3336S may also include a receiver capable of sensing changes inthe fields of the transmitter as the registration features on the cart3229 move along the scale. In this embodiment, the scale may extendcontinuously between the module interfaces 3016I₁, 3016I₂ at theopposite ends of the chamber module. In alternate embodiments, the scalemay extend only partially in the module, in the areas of the modulewhere fine position determination is desired. In this embodiment, thescale 3336S may include multiple sensing tracks 3336S1-3336S5, eachbeing capable of sensing the position of a corresponding sensorregistration features N1-N5 on the cart 3229. As seen in FIG. 30, cart3229 may have multiple sensor registration features N1-N5. As notedbefore, the sensor registration features N1-N5, in this embodiment arepassive (i.e. not powered) and, may include magnets or magneticmaterial. In the embodiment shown in FIG. 30, the cart 3229 may havefive sensor registration features N1-N5 to enable positioning of thecart 3229 as well as the movable platen. Two of the features, such asN4, N3 on the right and N1, N2 on the left, may be, used forregistration and positioning respectively of the right and left sides ofthe cart. Feature N5 in this embodiment is used for registration of themovable platen position. As seen in FIGS. 28 and 30, the registrationfeatures N1-N4, which in this case are positioned on the bottom of thecart in sufficient proximity to interact with the rails 3336S1-3336S4,are offset laterally to substantially align with the correspondingsensing track 3336S1-3336S4 of scale 3336S (see also FIG. 29). Also, theregistration features N3-N4, and N1-N2, used respectively for positiondetermination of the right and left sides of the cart 3229, are offsetat a longitudinal pitch 3000A sufficient for continuous positiondetermination of the cart when the cart traverses between modules 3016,3016A. For example, during passage from one module to the next, theoffset 3000A allows the rear most registration features N2, N4 tomaintain interaction with the corresponding tracks 3336S2, 3336S4 of themodule the cart is, leaving until after the lead most registration,features N1, N3 have commenced interaction (i.e. position determinationhas commenced) with the corresponding sensing tracks (similar to tracks3336S1, 3336S3) of the module the cart is entering. Hence, positioningof the cart 3229 is continuously established throughout the carttraverse motion within chamber 3014 (see FIG. 27). Registration featureN5 on platen 3172, allows, in cooperation with track 3336S5, forposition determination of the platen 3172 in a manner similar to thatdescribed above. A comparison of the position signals registered forfeatures N1-N4 and N5 (performed for example by the CPU) allows fordetermination of the relative position of the movable platen 3172. Therelative position information may then be used for controllingactivation of the substrate transfer device 3160 of the cart. Inalternate embodiment, the cart may have any other suitable arrangementof registration features, and may have more or fewer registrationfeatures, such as one registration feature for position determination ofeach side of the cart. In alternate embodiments, position determinationmay be achieved by a combination of rough position determination, usingcross positioning system 3340, and fine position determination withprecision positioning system 3336. For example, gross positioning system3340 (which may be any suitable position determination system such asHall effects type position sensing system or an electro-optic encodersystem, and may be less expensive to install throughout the modulechamber) may be used during general traverse motion of the cart 3229through the chamber module 3016, and also for positioning when the cartmoves from one module to another. The precision positioning system 3336may then be used in a more limited fashion, such as in cases wheregreater position determination accuracy is desired. For example, it isdesired to precisely determine the position of the cart 3229, as wellas, platen 3172, when transferring substrates to the process modules3020, 3020A. Accordingly, in the case installation of the active scale33368 may be sized to generally coincide with the region where ports3016P (see FIG. 27), communicating with the process modules 3020, arelocated. Also, a single registration feature per side, and anotherregistration feature for the movable platen 3172 may be sufficient forfine position determination of the cart 3229, and of the platen 3172 toenable accurate movement of the substrate transfer device 3160. As maybe realized from FIG. 29, signals from the gross and fine positiondetermination systems 3340, 3386 are communicated via suitable lines3336C, or via wireless means, for processing by the CPU, which in turnuses the position information for controlling the windings throughwindings control system 3790 (see FIG. 29). Though communication lines3336C have one or more couplings (similar to coupling 3790C) forcoupling to an off module CPU, the positioning systems 3340, 3336 of themodule are also capable of communicating directly with processors of thededicated winding control system, so that the chamber module 3016, mayautonomously, relative, to the overall tool control architecture,control operation of the windings to effect desired movement of the cart32229 and transfer device thereon.

As may be realized, each transport chamber module 3016, 3016A includessystems as described above, enabling the module to form a completetransport chamber for a processing tool. For example, the tool 3018 maybe configured to have a transport chamber 3014 of but one module,selected form the different but interchangeable module 3016, 3016A,3016B, 3016C, in a configuration similar to tool 18 shown in FIG. 5. Asshown in FIG. 27, the modules 3016, 3016Aj 3016B, 3016C may otherwise bejoined, in any selected order, by abutting the common interfaces of themodules to form a transport chamber 3014, and tool 3018 of desiredconfiguration. The autonomous overability of each module 3016, 3016A,3016B, 3016C allows assembly of the tool to be effected as easily ascompletion of the mechanical connection at the module interfaces.

It should be understood that the foregoing description is onlyillustrative of the invention. Various alternatives and modificationscan be devised by those skilled in the art without departing from theinvention. Accordingly, the present invention is intended to embrace allsuch alternatives, modifications and variances which fall within thescope of the appended claims.

1. A substrate processing apparatus comprising: a first end configuredfor loading a substrate into the substrate processing apparatus; anapparatus module, connected to the first end to allow the substrate tobe moved between the first end and the apparatus module, the apparatusmodule including a transport chamber module configured to hold acontrolled atmosphere therein, the transport chamber module defining alinear travel slot having opposite side walls where at least one of theside walls includes at least one sealable port configured to allowpassage of substrates to and from the transport chamber module; anotherapparatus module optionally connected to the apparatus module in seriesrelative to the front end; and a transport vehicle movably mountedwithin the transport chamber module for traversing the linear travelslot, the transport vehicle including a base and a substrate transferarm that is movably jointed and movably mounted to the base foreffecting transfer of the substrate between the transfer chamber moduleand each of the at least one sealable port on the at least one of theside walls.
 2. The substrate processing apparatus of claim 1, furthercomprising a linear motor disposed at least partly within the transportchamber module for driving the transport vehicle through the lineartravel slot, the linear motor being connected to the substrate transferarm for rotating the arm relative to the base and articulating the armin opposite directions.
 3. The substrate processing apparatus of claim1, wherein each of the at least one sealable port is configured forconnection to a substrate holding module.
 4. The substrate processingapparatus of claim 3, wherein the substrate holding module is asubstrate processing module or a load lock chamber module.
 5. Thesubstrate processing apparatus of claim 1, wherein the transport chambermodule includes opposite ends, each of the opposite ends including atleast one of the one or more sealable ports configured to allow passageof substrates to and from the transport chamber.
 6. The substrateprocessing apparatus of claim 5, wherein each of the at least onesealable port is configured for connection to a substrate holdingmodule.
 7. The substrate processing apparatus of claim 1, furthercomprising an alignment device connected to the transfer chamber module,wherein the transport vehicle includes a substrate holding chuckreleasably mounted to the transport vehicle, where the substrate holdingchuck is configured to be removed from the transport vehicle forplacement on the alignment device for rotationally aligning a substratethereon and the transport vehicle is configured to transport thesubstrate holding chuck through the transport chamber module.
 8. Thesubstrate processing apparatus of claim 7, wherein the substrate holdingchuck is releasably mounted to the substrate transfer arm.
 9. Thesubstrate processing apparatus of claim 1, wherein the transport chambermodule comprises at least one transport chamber module section that isconnectable to other transport chamber modules section for forming alongitudinally extended linear substrate transport chamber.
 10. Thesubstrate processing apparatus of claim 9, wherein at least onetransport chamber module section includes a removable access panel,where when the panel is removed access is provided to an internal areaof the at least one transport chamber.
 11. A substrate processingapparatus comprising: a first end configured for loading a substrateinto the substrate processing apparatus; an apparatus module, connectedto the first end to allow the substrate to be moved between the firstend and the apparatus module, the apparatus module including a transportchamber module configured to hold a controlled atmosphere therein, thetransport chamber module defining a linear travel slot having oppositeside walls where at least one of the side walls includes at least onesealable port configured to allow passage of substrates to and from thetransport chamber module; another apparatus module optionally connectedto the apparatus module in series relative to the front end; and atransport vehicle movably mounted within the transport chamber module ofthe apparatus module for traversing the linear travel slot, thetransport vehicle including a base and a substrate transfer arm that ismovably mounted to the base for effecting transfer of the substratebetween the transfer chamber module and each of the at least onesealable port on the at least one of the side walls.
 12. The substrateprocessing apparatus of claim 11, further comprising a linear motordisposed at least partly within the transport chamber module for drivingthe transport vehicle through the linear travel slot, the linear motorbeing connected to the substrate transfer arm for rotating the armrelative to the base and articulating the arm in opposite directions.13. The substrate processing apparatus of claim 11, wherein each of theat least one sealable port is configured for connection to a substrateholding module.
 14. The substrate processing apparatus of claim 13,wherein the substrate holding module is a substrate processing module ora load lock chamber module.
 15. The substrate processing apparatus ofclaim 11, wherein the transport chamber module includes opposite ends,each of the opposite ends including at least one of the one or moresealable ports configured to allow passage of substrates to and from thetransport chamber.
 16. The substrate processing apparatus of claim 15,wherein each of the at least one sealable port is configured forconnection to a substrate holding module.
 17. The substrate processingapparatus of claim 11, further comprising an alignment device connectedto the transfer chamber module, wherein the transport vehicle includes asubstrate holding chuck releasably mounted to the transport vehicle,where the substrate holding chuck is configured to be removed from thetransport vehicle for placement on the alignment device for rotationallyaligning a substrate thereon and the transport vehicle is configured totransport the substrate holding chuck through the transport chambermodule.
 18. The substrate processing apparatus of claim 17, wherein thesubstrate holding chuck is releasably mounted to the substrate transferarm.
 19. The substrate processing apparatus of claim 11, wherein thetransport chamber module comprises at least one transport chamber modulesection that is connectable to another transport chamber module sectionfor forming a longitudinally extended linear substrate transportchamber.
 20. The substrate processing apparatus of claim 19, wherein atleast one transport chamber module section includes a removable accesspanel, where when the panel is removed access is provided to an internalarea of the at least one transport chamber.
 21. The substrate processingapparatus of claim 11, wherein the substrate transfer arm is movablyjointed.
 22. The substrate processing apparatus of claim 21, wherein thesubstrate transfer arm is a SCARA-type arm.
 23. The substrate processingapparatus of claim 11, wherein the substrate transfer arm is configuredto move along a linear path relative to the transport vehicle base. 24.The substrate processing apparatus of claim 23, wherein the transportvehicle includes at least one slide and substrate transfer arm includesat least one end effector and wherein the at least one end effector isconfigured to move along the at least one slide to provide linear motionof the at least one end effector.
 25. The substrate processing apparatusof claim 23, wherein the transport vehicle includes at least one slideand substrate transfer arm includes at least one end effector and aframe and wherein the at least one end effector and the frame areconfigured to move along the at least one slide to provide linear motionof the frame and the at least one end effector.